Replacing Wire With Laser, Sun Tries to Speed Up Data
| March 24, 2008 |  View for printing |
Sun Microsystems is gambling on using beams of light to connect processor chips, eliminating a bottleneck.
Sun Microsystems is trying to do for computing what all the king’s horses and men failed to do for Humpty Dumpty. For decades, the semiconductor industry has broken silicon wafers into smaller chips to improve manufacturing yields.
Now Sun has found a way to reconnect the chips so they can communicate with each other at such high speeds that computer designers can build a new generation of computers that are faster, more energy-efficient and more compact.
By JOHN MARKOFF
Full Story: http://www.nytimes.com/2008/03/24/te ... 4wafer.html
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