Tessera Brings Chip-Scale Packaging Capabilities to North Dakota State University

NDSU Electronics Center Ready to Assemble CSP-based Semiconductor Products for Technology Companies and Government Agencies

Tessera Technologies, Inc. (Nasdaq:TSRA), a leading provider of miniaturization technologies for the electronics industry, today announced that it has completed a successful chip-scale packaging (CSP) technology transfer to North Dakota State University (NDSU) and has partnered with NDSU in the development of a fully functional microelectronics center at the university.

As part of a multi-year government program sponsored by the Defense Microelectronics Activity (DMEA), Tessera has licensed its MicroBGA(R) CSP technology to NDSU and has provided the university with the technical knowledge and training necessary to package and assemble semiconductor chips, such as EEPROM, DRAM and Flash memory. These semiconductor devices are widely utilized in defense, medical, wireless, consumer and computing electronics to meet next-generation miniaturization, performance and reliability requirements.

Today’s announcement marks the culmination of a joint effort by Tessera and NDSU to create a regional microelectronics center supporting the manufacturing needs of government agencies while facilitating the growth of technology companies.

"We are very excited about our partnership with NDSU in developing a world-class microelectronics packaging R&D center," said Nicholas Colella, senior vice president of the Product Miniaturization Division at Tessera. "NDSU gains a new resource for winning advanced development funding, while advancing its educational and research facilities. Tessera gains access to an academic community that will be applying new materials to chip-scale packaging. We hope to use this successful technology transfer as a model for future government and academic programs."

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